Journal Report

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING

Download PDF
Journal Information
Journal Title
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
Publisher
IEEE
ISSN
0894-6507
E-ISSN
1558-2345
Database
Clarivate
Domain
Physical Sciences, Social Sciences
Classification History
Year A+ A B C
2026 ✓ ✓
2025 ✓ ✓
2024 ✓ ✓
2023 ✓ ✓
2021/2022 ✓ ✓
2020 ✓ ✓
2019 ✓ ✓
2018 ✓
A journal may have more than one classification in the same year. All recorded classifications are displayed.
Recent Articles
Micro-Scratch Detection on Wafer Surfaces Based on Strip Convolution and High-Resolution Feature Reconstruction
Dan Jiang, Songbin Li, Yisheng Sun
2026-8 Vol. 39 Issue 3 Pages 430-440
DOI: 10.1109/tsm.2026.3714028
Lithographic Hotspot Detection Based on Dual-Branch Feature Fusion and Attention Augmentation
Hui Xu, Yunhong Huo, Guoshuai Wang et al.
2026-8 Vol. 39 Issue 3 Pages 478-486
DOI: 10.1109/tsm.2026.3704426
Mitigating Process-Induced Wafer Distortion for Enhanced Overlay and Thickness Uniformity
Kangjian Cheng, Jingyan Huang, Wen Siang Lew
2026-8 Vol. 39 Issue 3 Pages 524-530
DOI: 10.1109/tsm.2026.3710173
Attention-Based Deep Learning for Multi-Target Prediction of Process Time and Tool Availability in Large-Scale Semiconductor Fabs
T. E. Korabi, G. Goossen, A. Kaushik et al.
2026-8 Vol. 39 Issue 3 Pages 395-401
DOI: 10.1109/tsm.2026.3706122
Front Cover
2026-8 Vol. 39 Issue 3 Pages C1-C1
DOI: 10.1109/tsm.2026.3716520
Unified Machine Learning Framework for Process–Device–Circuit Variability Quantification of Inner Spacer Etch in GAA FETs
Om Maheshwari, Nihar Ranjan Mohapatra
2026-8 Vol. 39 Issue 3 Pages 410-416
DOI: 10.1109/tsm.2026.3701836
Investigation of Radial Micro-Bubble Defects Caused by Organic Contamination
Jaein Jeong, Eun a Ko, Youngjeong Kim
2026-8 Vol. 39 Issue 3 Pages 388-394
DOI: 10.1109/tsm.2026.3702942
High-Precision Acoustic Image Reconstruction for Uneven Surfaces Using a YOLO-Based Approach
Thi Thu Ha Vu, Tan Hung Vo, Jaeyeop Choi et al.
2026-8 Vol. 39 Issue 3 Pages 441-452
DOI: 10.1109/tsm.2026.3691744
D2Seg: Dual-Image Differential Interleaved Semantic Segmentation Network for Accurate Semiconductor Wafer Surface Defect Detection
Zhaolei Diao, Shuang Mei, Jiangtao Cheng et al.
2026-8 Vol. 39 Issue 3 Pages 453-463
DOI: 10.1109/tsm.2026.3689722
Effect and Mechanism of SiO <sub>2</sub> Polishing Slurry on Chemical Mechanical Polishing Technology in Semiconductor Manufacturing
Ya Peng, Zuozuo Wu, Wei Zhou et al.
2026-8 Vol. 39 Issue 3 Pages 503-514
DOI: 10.1109/tsm.2026.3702103
Articles retrieved from Crossref.
Green Journals | https://www.green-journals.com | info@green-journals.com
Printed: October 31, 2026 13:09