Journal Report

Microelectronics Reliability

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Journal Information
Journal Title
Microelectronics Reliability
Publisher
Elsevier Ltd
ISSN
0026-2714
E-ISSN
Database
SCOPUS
Domain
Physical Sciences, Social Sciences
Classification History
Year A+ A B C
2026 ✓ ✓
2025 ✓ ✓
2024 ✓ ✓
2023 ✓ ✓
2021/2022 ✓ ✓
2020 ✓ ✓
2019 ✓ ✓
2018 ✓
A journal may have more than one classification in the same year. All recorded classifications are displayed.
Recent Articles
Yield strength–residual stress coupling in fretting-induced electrical degradation of Ag–Ni electrical contact coatings
Xue Zhou, Mingxu Zhang, Guofu Zhai et al.
2026-12 Vol. 187 Pages 116343
DOI: 10.1016/j.microrel.2026.116343
Thermo-mechanical simulation and reliability analysis of 3D-printed stacked memory packages
Doyun Kim, Junwoo Park, Mun Goung Jeong et al.
2026-12 Vol. 187 Pages 116348
DOI: 10.1016/j.microrel.2026.116348
Active thermography-based detection of thermistor joints using difference shadow method and deep learning algorithm
Jiayi Yuan, Zhenzhi He, Bo Sun et al.
2026-12 Vol. 187 Pages 116330
DOI: 10.1016/j.microrel.2026.116330
Maximum likelihood Weibull analysis of repetitive short-circuit stress in asymmetrical trench SiC MOSFETs
Krisztián Kovács, Michal Minárik, Jozef Kozárik et al.
2026-12 Vol. 187 Pages 116322
DOI: 10.1016/j.microrel.2026.116322
Power cycling lifetime model considering chip surface temperature gradient for power semiconductor devices
Erping Deng, Maoyang Pan, Lixin Wu et al.
2026-12 Vol. 187 Pages 116352
DOI: 10.1016/j.microrel.2026.116352
Multiphysics simulation for solder joint reliability analysis and lifetime prediction: A review
Wenliang Qi, Zhaoyang Xue, Yang Xu et al.
2026-12 Vol. 187 Pages 116351
DOI: 10.1016/j.microrel.2026.116351
Investigations on the degradation of IGBT under repetitive short-circuit tests
Yuzheng Huang, Zhonghao Dongye, Binru Zhao et al.
2026-12 Vol. 187 Pages 116350
DOI: 10.1016/j.microrel.2026.116350
RASP: Reliability ab initio simulation package of MOSFETs based on all-state model
Xinjing Guo, Menglin Huang, Shiyou Chen
2026-12 Vol. 187 Pages 116340
DOI: 10.1016/j.microrel.2026.116340
Backside power delivery as a thermal remedy for buried-oxide self-heating in 3 nm complementary Forksheet CMOS
Bhubesh Chander Joshi, Ajeet Kumar
2026-12 Vol. 187 Pages 116341
DOI: 10.1016/j.microrel.2026.116341
Mechanism on solder-IMC crack formation in fine-pitch BGA packages
F.F. Huang, X.Y. Liu, M.L. Huang
2026-12 Vol. 187 Pages 116329
DOI: 10.1016/j.microrel.2026.116329
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Printed: November 9, 2026 14:49