Journal Report

SOLDERING & SURFACE MOUNT TECHNOLOGY

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Journal Information
Journal Title
SOLDERING & SURFACE MOUNT TECHNOLOGY
Publisher
EMERALD GROUP PUBLISHING LTD
ISSN
0954-0911
E-ISSN
1758-6836
Database
Clarivate
Domain
Health Sciences, Physical Sciences, Social Sciences
Classification History
Year A+ A B C
2026 ✓ ✓
2025 ✓ ✓
2024 ✓ ✓
2023 ✓ ✓
2021/2022 ✓ ✓
2020 ✓ ✓
2019 ✓ ✓
2018 ✓
A journal may have more than one classification in the same year. All recorded classifications are displayed.
Recent Articles
Optimized microstructure and enhanced multifunctional properties of Sn-25Bi solder alloys reinforced with exfoliated Ti3C2Tx MXene nanosheets
Sallah A. Al Hashedi, Hamed Al-Sorory, Adil Alshoaibi et al.
2026-10-15 Vol. 38 Issue 5 Pages 355-365
DOI: 10.1108/ssmt-05-2026-0044
Thermal effects of die-attach void fraction and position in high-power LED packages: a three-dimensional finite-element study
Viet-Dung Le
2026-10-12 Vol. 38 Issue 5 Pages 409-417
DOI: 10.1108/ssmt-07-2026-0062
Experimental and numerical investigation of Sn–BiSAC hybrid solder joints with process optimization via Taguchi method
Atikah Liyana Ahamad, Muhamed Abdul Fatah Muhamed Mukhtar, Muhammad Khairul Anuar Mohamed et al.
2026-9-24 Vol. 38 Issue 5 Pages 379-398
DOI: 10.1108/ssmt-05-2026-0035
Interfacial IMC evolution and mechanical performance of In-doped Sn58Bi solder joints subjected to isothermal aging
Lei Sun, Wenhao Wang, Jiaxin Yu et al.
2026-9-10 Vol. 38 Issue 5 Pages 399-408
DOI: 10.1108/ssmt-07-2026-0060
Influence of loading time on the microstructures and performance of Cu/Al joints by bonding at a low temperature of 160°C
Guisheng Gan, JunFeng Dou, JiaJun Zhang et al.
2026-8-28 Vol. 38 Issue 5 Pages 366-378
DOI: 10.1108/ssmt-05-2026-0033
Reliability analysis of large area sintered Cu interconnects based on simulation and thermal shock test
Jiaqi Gao, Yang Liu, Yue Gao et al.
2026-8-11 Pages 1-11
DOI: 10.1108/ssmt-11-2025-0071
Research on the protrusion behavior and evolution mechanism of TSV in 3D packaging under high temperature
Jiahao Liu, Lijin Qiu, Bin Zhou et al.
2026-8-3 Pages 1-9
DOI: 10.1108/ssmt-02-2026-0014
Retraction notice: Reliability modeling and assessment of solder joints of electronic assemblies under mixed exposure to mechanical loads
2026-7-28 Vol. 38 Issue 5 Pages 418-418
DOI: 10.1108/ssmt-07-2026-0055
Influence of electron irradiation on the power cycling lifetime of SiC MOSFETs
Yuxiong Xue, Jiayan Li, Bo Mei et al.
2026-6-15 Vol. 38 Issue 5 Pages 343-354
DOI: 10.1108/ssmt-03-2026-0027
Mechanical response of BGA micro solder joints with different shape combinations under thermal cycling
Xiangxia Kong, Zuchen Liu, Lu Yang et al.
2026-6-10 Vol. 38 Issue 5 Pages 321-330
DOI: 10.1108/ssmt-01-2026-0003
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Printed: November 9, 2026 05:07