Journal Report

Journal of Microelectronics and Electronic Packaging

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Journal Information
Journal Title
Journal of Microelectronics and Electronic Packaging
Publisher
IMAPS-International Microelectronics and Packaging Society
ISSN
1551-4897
E-ISSN
1555-8037
Database
SCOPUS
Domain
Physical Sciences
Classification History
Year A+ A B C
2026 ✓
2025 ✓
2024 ✓
2023 ✓
2021/2022 ✓
2020 ✓
2019 ✓
2018
A journal may have more than one classification in the same year. All recorded classifications are displayed.
Recent Articles
Evaluating MEMS Switch Lifetime at Cryogenic Temperatures
Elizabeth Sorenson, Peter Bradley, Damian Lauria et al.
2026-9-15 Vol. 23 Issue 3
DOI: 10.4071/001c.163972
Glass Packaging for Chiplets Heterogeneous Integration
John H Lau
2026-9-15 Vol. 23 Issue 3
DOI: 10.4071/001c.169986
Cu-Cu Hybrid Bonding for Chiplets Heterogeneous Integration
John H Lau
2026-9-15 Vol. 23 Issue 3
DOI: 10.4071/001c.164804
Jet-Dispensing Process Development for a Microparticle-Based Ag Sintering Paste for Pressureless Sintering of Miniaturized Opto-Electronic Components
Linus Daniel Stier, Marc Dreissigacker, Mathias Koch et al.
2026-6-15 Vol. 23 Issue 2
DOI: 10.4071/001c.161566
Laser Cleaning Cylindrical Cells for Optimum Wire Bondability
Dominik Haering, Mike McKeown, Louis Castellanos et al.
2026-6-15 Vol. 23 Issue 2
DOI: 10.4071/001c.161569
Scalable Manufacturing of Multi-Stacked Copper Spiral Inductors Using a Novel Fully Additive Method
Roghayeh Imani, Shailesh Chouhan, Jerker Delsing
2026-3-15 Vol. 23 Issue 1
DOI: 10.4071/001c.156232
Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
Ning Liu, Shahram Seyedmohammadi, Howard Yun et al.
2026-3-15 Vol. 23 Issue 1
DOI: 10.4071/001c.156183
Engineering a Tunable Cu-Selective Oxide-Suppressing Coating to Enable Reliable Cu-to-Cu Direct Bonding for Advanced Interconnects
Kevin Antony Jesu Durai, Duwage Anushka Sandaruwan Perera, Khanh Tuyet Anh Tran et al.
2026-3-15 Vol. 23 Issue 1
DOI: 10.4071/001c.157833
Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation
Shyam Muralidharan Nair, Duwage Anushka Sandaruwan Perera, Gavin Farmer et al.
2026-3-15 Vol. 23 Issue 1
DOI: 10.4071/001c.156190
Jet Dispensing of Liquid Metal as a Thermal Interface Material
Sunny Agarwal, Miloš Lazić
2025-12-15 Vol. 22 Issue 4
DOI: 10.4071/001c.147767
Articles retrieved from Crossref.
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Printed: November 4, 2026 18:31